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Taiwan, Netherlands Semi Firms Jointly Build Wafer Fab in Singapore; Monthly Capacity Expected to Hit 55K Units in 2029
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VIS announced six months ago that it had planned to establish a joint venture, VisionPower Semiconductor Manufacturing Company, with NXP Semiconductors of the Netherlands to build a 12-inch (300mm) wafer fab in Singapore. The groundbreaking ceremony for the project took place today.

According to the introduction, the relevant fab will use 130-40 nm technology to produce mixed-signal, power management and analog products to support the needs of end markets such as automotive, industrial, consumer electronics and mobile devices. The relevant technology licensing and technology transfer is expected to come from TSMC (TSM.US).

VIS foresaw the first fab to begin mass production in 2027, with a monthly capacity of 55,000 12-inch wafers by 2029, creating approximately 1,500 jobs.
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